Akasa Pro-grade+ 5026 heat sink compound 2.9 W/m·K 3 g

SKU

AK-TC5026

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Out of stock

2.9 W/mK, 100K cP, 3g

Outperformed similar compounds when the CPU was under load
Thermally conductive technology behind Akasa’s fanless case evolution
Ultra-thin bond lines & lo-thermal resistance for superior thermal performance
Non-electrically conductive & non pressure dependant compound
RoHS compliant
Easy-to-use syringe applicator and spreader

Category: Heat Sink Compounds

More Information

More Information
SKU	AK-TC5026
EAN	4710614539358
Manufacturer	Akasa
Availability	N
Product Manuals (HTML)	View Manual

Reviews

Nickname

Summary

Review

Description

Excellent thermal performance, even at lo-pressures.

When every degree matters, get more from your cooler. Pro-grade+ silicone-tech evolution 5026 provides ultra thin bond lines, hi-thermal conductivity and hi-temperature stability, creating the ultimate thermal compound. It’s suitable for all CPUs and applications, from fanless cases to hi-performance coolers.

Specifications

Features
Constitutive ingredients	Silicone
Thermal resistance	0.03 °C/W
Thermal conductivity	2.9 W/m·K
Operating temperature (T-T)	-45 - 200 °C
Product colour	Grey
Specific gravity	3.23 g/cm³
Technical details
Compliance certificates	RoHS
Constitutive ingredients	Silicone
Thermal resistance	0.03 °C/W
Thermal conductivity	2.9 W/m·K
Operating temperature (T-T)	-45 - 200 °C
Weight & dimensions
Weight	3 g

Packaging data
Quantity per pack	1 pc(s)
Operational conditions
Operating temperature (T-T)	-45 - 200 °C
Colour
Product colour	Grey
Logistics data
Quantity per pack	1 pc(s)

Akasa Pro-grade+ 5026 heat sink compound 2.9 W/m·K 3 g

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